[China] HiSilicon and IMEC to cooperate on RF R&D at 28nm
 
HiSilicon, a China-based company, and European R&D consortium IMEC have signed a strategic research collaboration to develop RF transceiver architectures for next-generation mobile terminals using 28nm process technology.

The project is part of Imec’s R&D program on cognitive reconfigurable radio and its goal to jointly conceive low-power and compact high-performance reconfigurable RF transceivers leveraging on state-of-the-art CMOS technology.

Imec’s cognitive reconfigurable radio front-end program investigates reconfigurable RF solutions, high-speed/low-power analog-to-digital converters (ADCs) and new approaches to digitize future RF architectures and minimize antenna interface requirements.

The program aims at developing small, cost-, performance- and power-competitive reconfigurable radio transceivers in 28nm digital CMOS technology covering all key broadband communication standards including next generation cellular and connectivity standards such as LTE advanced and next-generation WiFi (802.11ac), according to the statement.

"We are excited to welcome HiSilicon as one of the world’s leading IC design companies and we are honored with this commitment. The new partnership with HiSilicon reflects the value that imec brings to its industry partners in this RF research program;" said Liesbet Van der Perre, Director Green Radio program line at IMEC, in a statement.

“We hope that together with imec, we will realize innovative transceiver architectures utilizing the advantages of new technologies (28nm CMOS and beyond). We expect these solutions can drastically improve the performance while reducing area and power consumption,” Chen Zhen, Director of HiSilicon wireless chipset infrastructure architecture and system design dept.

HiSilicon Technologies Co., Ltd. was established in October 2004 and is headquarter in Shenzhen of China with design divisions in Beijing, Shanghai, Sweden and in Silicon Valley. It provides ASICs for communication networks.
 
Source: EETimes
 
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